Package Portfolio

- Redistribution Layer(RDL)
We offer RDL made with Cu/Ni/Au plated bond pads for Au or Cu wire bonding to achieve optimized bondability and reliability.......... more

- Copper Pillar Bump
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The Copper Pillar Bump (CPB) structure exhibits improved electron-migration resistance........ ....... more

- Solder Bump
Bumping is replacing wire bonding as the connecting method to accommodate........................ more

- Wafer Lavel BGA
A Wafer Level BGA (WLBGA) is essentially the same size as the die, providing a high performance package.................................... more

Turnkey Services

- Turnkey solution
NOW, one-stop solutions for 12” semiconductor packaging is available in Singapore
• Why Singapore is better than the others?
- World class logistics infrastructure for quick turnaround
- Qualified human resources
- Political and geographic stability
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Press Release


Powertech Technology Inc to acquire Nepes Pte Ltd in Singapore

Singapore - April 29, 2014  - Powertec Technology Inc. (PTI, TWSE:6239) announced today that it has entered into a Share Purchase Agreement with Nepes Corp. (NC, KOSDAQ:033640 ) to acquire Nepes Pte Ltd (NPL) in Singapore.

With the acquisition of NPL's operationally ready, high volume 300mm electroplated wafer bumping and wafer level packaging manufacturing operations, PTI will establish its capabilities for electroplated wafer bumping and turnkey wafer level "chip scale" packaging in Singapore...........................
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